发明授权
- 专利标题： Semiconductor device and a method of manufacturing the same and an electronic device
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申请号： US09450676申请日： 1999-11-30
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公开(公告)号： US06410987B1公开(公告)日： 2002-06-25
- 发明人: Kouichi Kanemoto , Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Mikako Kimura
- 申请人： Kouichi Kanemoto , Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Mikako Kimura
- 优先权： JP10-343265 19981202; JP11-019370 19990128
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
A first semiconductor chip (2) is bonded and secured to a second semiconductor chip (3) with a back surface of the first semiconductor chip (2) and a circuit forming surface (3X) of the second semiconductor chip (3) facing each other, and an inner portion of a support lead (6) is bonded and secured to the circuit forming surface (3X) of the second semiconductor chip (3). Such a configuration makes it possible to provide a semiconductor with a reduced thickness.
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