An image pickup section incorporates a solid-state image pickup element chip. Electronic parts for driving or controlling the image pickup section are mounted on a circuit board. First and second electrode pad groups are formed on the circuit board, and a separation band is also formed on the circuit board between the first and second electrode pad groups. The circuit board is used as it is when the image pickup device is not required to be bendable. When the image pickup device is required to be bendable, the circuit board is separated by cutting it at the separation band and the first and second electrode pad groups that are now respectively located on the separated pieces of the circuit board are connected to each other by signal lines.