发明授权
US06423176B1 Particle-removing apparatus for a semiconductor device manufacturing apparatus and method of removing particles 失效
用于半导体器件制造装置的除粒装置和除去颗粒的方法

  • 专利标题: Particle-removing apparatus for a semiconductor device manufacturing apparatus and method of removing particles
  • 专利标题(中): 用于半导体器件制造装置的除粒装置和除去颗粒的方法
  • 申请号: US09685351
    申请日: 2000-10-10
  • 公开(公告)号: US06423176B1
    公开(公告)日: 2002-07-23
  • 发明人: Natsuko ItoFumihiko UesugiTsuyoshi Moriya
  • 申请人: Natsuko ItoFumihiko UesugiTsuyoshi Moriya
  • 优先权: JP10-101090 19980413
  • 主分类号: H05H100
  • IPC分类号: H05H100
Particle-removing apparatus for a semiconductor device manufacturing apparatus and method of removing particles
摘要:
In a semiconductor device manufacturing apparatus that processing a substrate by applying a voltage to a gas to create a plasma, positively charged particles are trapped or guided at the instant that the cathode voltage is stopped, by an electrode to which is imparted a negative voltage, so as to prevent particles reaching the substrate.
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