发明授权
US06423463B1 Photosensitive resin composition, photosensitive resin film, and method of forming bumps using same
有权
感光性树脂组合物，感光性树脂膜以及使用其形成凸块的方法
- 专利标题： Photosensitive resin composition, photosensitive resin film, and method of forming bumps using same
- 专利标题（中）： 感光性树脂组合物，感光性树脂膜以及使用其形成凸块的方法
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申请号： US09516211申请日： 2000-02-29
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公开(公告)号： US06423463B1公开(公告)日： 2002-07-23
- 发明人: Masaru Oota , Isamu Mochizuki , Kouichi Hirose , Yasuaki Yokoyama , Hozumi Sato
- 申请人： Masaru Oota , Isamu Mochizuki , Kouichi Hirose , Yasuaki Yokoyama , Hozumi Sato
- 优先权： JP11-057022 19990304
- 主分类号： G03F7023
- IPC分类号： G03F7023
摘要：
A positive-tone photosensitive resin composition for forming a thick film which is suitably used for photofabrication such as manufacture of circuit boards, a photosensitive resin film, and a method of forming a bump using the same. The photosensitive resin composition comprising (A) a novolac resin with a weight average molecular weight of 2,000-30,000, (B) a polyvinyl lower alkyl ether, (C) a polyphenol derivative compound with a molecular weight of 200-1,000, and (D) a compound containing a naphthoquinonediazido group.
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