发明授权
US06424399B1 Active matrix substrate and liquid crystal display apparatus having electrical continuity across contact holes, and method for producing the same 失效
在接触孔上具有导通性的有源矩阵基板和液晶显示装置及其制造方法

  • 专利标题: Active matrix substrate and liquid crystal display apparatus having electrical continuity across contact holes, and method for producing the same
  • 专利标题(中): 在接触孔上具有导通性的有源矩阵基板和液晶显示装置及其制造方法
  • 申请号: US09318996
    申请日: 1999-05-26
  • 公开(公告)号: US06424399B1
    公开(公告)日: 2002-07-23
  • 发明人: Yasunori ShimadaHisakazu NakamuraKoji Taniguchi
  • 申请人: Yasunori ShimadaHisakazu NakamuraKoji Taniguchi
  • 优先权: JP7-309612 19951128; JP8-056579 19960313
  • 主分类号: G02F1136
  • IPC分类号: G02F1136
Active matrix substrate and liquid crystal display apparatus having electrical continuity across contact holes, and method for producing the same
摘要:
A reflection type liquid crystal display apparatus includes: a first substrate having a plurality of reflecting electrodes; a second substrate having a light transmitting electrode; and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes an insulating substrate, a switching device provided on the insulating substrate for supplying a display voltage signal to the reflecting electrode, a drawing-out electrode connected to the switching device and extending under the reflecting electrode, and an insulating resin layer having a contact hole on the drawing-out electrode. The reflecting electrode is provided on the insulating resin layer, corresponding to each pixel, so as to cover the contact hole, and is electrically connected to the drawing-out electrode at the bottom of the contact hole. The drawing-out electrode has at least two different metal layers in a region larger than a bottom of the contact hole, the region including the bottom of the contact hole, and a metal layer which is an uppermost layer of the drawing-out electrode is removed at the bottom of the contact hole in the direction of a thickness either partially or until an underlying metal layer is reached.
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