发明授权
- 专利标题: Adhesive film for electronic parts
- 专利标题(中): 电子部件用胶粘剂
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申请号: US09374257申请日: 1999-08-13
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公开(公告)号: US06426138B1公开(公告)日: 2002-07-30
- 发明人: Hitoshi Narushima , Toshihiro Nakajima
- 申请人: Hitoshi Narushima , Toshihiro Nakajima
- 优先权: JP10-238382 19980825
- 主分类号: C09J702
- IPC分类号: C09J702
摘要:
The present invention provides an adhesive film for electronic parts, for example, an adhesive agent in a tape BGA (Ball Grid Array) or &mgr;-BGA (trade name) package, in which embedding and adhesion to copper patterns on circuit boards are excellent, in which feeding and punching quality in the film state are superior, and which can reduce stress caused by thermal expansion difference between a circuit board and a reinforcing metal board or an IC chip. Adhesive film for electronic parts comprises a resin layer in which the dynamic modulus of elasticity at −30 to 125° C. is from 1 to 30 MPa and adhesive layers are coated on surfaces of the resin layer.