A plurality of conductors and an electrical component are disposed on a substrate, wherein the electrical component has a plurality of leads that are connected to the conductors on the substrate by a plurality of bond wires. A damping material is then situated in contact with the plurality of bond wires, the damping material chosen so that the plurality of bond wires can move in relation to the damping material. The damping material may be a viscous liquid kept in contact with the bond wires by a containing lid attached to the substrate. Alternatively, the damping material may be a colloidal mixture involving a liquid or an elastomer.