发明授权
- 专利标题： Interposer tape for semiconductor package
- 专利标题（中）： 用于半导体封装的插入式磁带
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申请号： US09478972申请日： 2000-01-06
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公开(公告)号： US06429534B1公开(公告)日： 2002-08-06
- 发明人: Qwai H. Low , Chok J. Chia , Maniam Alagaratnam
- 申请人： Qwai H. Low , Chok J. Chia , Maniam Alagaratnam
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
Provided is an interposer tape which provides electrical communication between a die and a packaging substrate. The dimensions of the interposer tape may vary to accommodate a variety of die sizes for the same packaging substrate. The interposer tape includes an array of traces. A first set of wire bonds is formed between the array of traces and the die. A second set of wire bonds is formed between the array of traces and the packaging substrate.
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