An electronic device, such as an integrated circuit, hybrid circuit or a transistor, is enclosed within an electronic package or module so as to be protected from contaminants and the external environment. An electronic device is enclosed within a package or module having a lid or cover that is sealed with an adhesive preform that has been pre-applied onto the bonding areas of the lid. The adhesive preforms are formed of a wet adhesive with gaps and are B-staged or dried to form dry solid adhesive preforms through chemical cross-linking or solvent removal. Both the lids and the adhesive preforms are formed of electrically insulating or of electrically conductive materials. The lids and adhesive preforms are attached to the electronic package or module by bonding the adhesive preforms at temperatures that are substantially lower than those at which the soldering of conventional lids is typically performed, and the adhesive flows to close the gaps.