发明授权
US06432795B1 Method of fabricating a cylindrical capacitor storage node having HSG silicon on inner wall thereof in a semiconductor device 失效
在半导体器件中制造其内壁上具有HSG硅的圆柱形电容器存储节点的方法

  • 专利标题: Method of fabricating a cylindrical capacitor storage node having HSG silicon on inner wall thereof in a semiconductor device
  • 专利标题(中): 在半导体器件中制造其内壁上具有HSG硅的圆柱形电容器存储节点的方法
  • 申请号: US09705786
    申请日: 2000-11-06
  • 公开(公告)号: US06432795B1
    公开(公告)日: 2002-08-13
  • 发明人: Kyu-Hyun Lee
  • 申请人: Kyu-Hyun Lee
  • 优先权: KR99-49109 19991106
  • 主分类号: H01L218242
  • IPC分类号: H01L218242
Method of fabricating a cylindrical capacitor storage node having HSG silicon on inner wall thereof in a semiconductor device
摘要:
A method of fabricating a capacitor storage node having HSG silicon on inner walls thereof, wherein the HSG silicon is formed on the inner walls of the storage node after a sacrificial insulating layer is removed, thereby increasing overall surface area of the storage node and preventing electrical bridges between adjacent storage nodes. The storage node is made of a double layer including a layer of crystallized silicon and a layer of amorphous silicon, formed in a storage opening that is formed in the sacrificial insulating layer. The crystallized silicon defines outer walls of the storage node and the amorphous silicon defines inner walls. After forming the storage node opening in the sacrificial insulating layer, crystallized silicon is formed in the opening. Amorphous silicon is then formed on the crystallized silicon. After removing the sacrificial insulating layer, HSG silicon is formed on the amorphous silicon layer.
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