发明授权
US06433563B1 Probe card with rigid base having apertures for testing semiconductor device, and semiconductor device test method using probe card
有权
具有用于测试半导体器件的孔的具有刚性基座的探针卡，以及使用探针卡的半导体器件测试方法
- 专利标题： Probe card with rigid base having apertures for testing semiconductor device, and semiconductor device test method using probe card
- 专利标题（中）： 具有用于测试半导体器件的孔的具有刚性基座的探针卡，以及使用探针卡的半导体器件测试方法
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申请号： US09417706申请日： 1999-10-13
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公开(公告)号： US06433563B1公开(公告)日： 2002-08-13
- 发明人: Shigeyuki Maruyama
- 申请人： Shigeyuki Maruyama
- 优先权： JP11-110061 19990416
- 主分类号： G01R3102
- IPC分类号： G01R3102
摘要：
The present invention relates to the testing method of a probe card and semiconductor device to conduct the testing to each chip in the wafer condition where a plurality of chips and CSPs (Chip Size Packages) are formed. The probe card is characterized by including a flexible contact board, a plurality of contact electrode groups provided in a predetermined layout on the contact board, a rigid base provided on the contact board between the contact electrode groups to have an aperture to expose the contact board of the area where the contact electrode is formed and wiring provided on the contact board and connected to the contact electrode. The advantages of the probe card is that it can always attain good contact condition of each chip and electrode pad of CSP on the occasion of testing the chip and CSP in the wafer condition.
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