CMP polishing pad including a solid catalyst

Invention Grant

US06435947B2 CMP polishing pad including a solid catalyst 有权

Title translation: CMP抛光垫包括固体催化剂

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Patent Title: CMP polishing pad including a solid catalyst
Patent Title (中): CMP抛光垫包括固体催化剂
Application No.: US09766750

Application Date: 2001-01-22
Publication No.: US06435947B2

Publication Date: 2002-08-20
Inventor: Brian L. Mueller , Shumin Wang
Applicant: Brian L. Mueller , Shumin Wang
Main IPC: B24B100
IPC: B24B100

CMP polishing pad including a solid catalyst

Abstract:

A polishing pad comprising a polishing pad substrate and at least one solid catalyst, the polishing pad being useful to remove metal layers from a substrate.

Abstract(Chinese):

一种抛光垫，包括抛光垫基材和至少一种固体催化剂，所述抛光垫可用于从基底去除金属层。

Public/Granted literature

US20010036804A1 CMP polishing pad including a solid catalyst Public/Granted day:2001-11-01

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