- 专利标题： Electrolytic copper plating method
-
申请号： US09313045申请日： 1999-05-17
-
公开(公告)号： US06444110B1公开(公告)日： 2002-09-03
- 发明人: Leon R. Barstad , James E. Rychwalski , Mark Lefebvre , Stephane Menard , James L. Martin , Robert A. Schetty, III , Michael Toben
- 申请人： Leon R. Barstad , James E. Rychwalski , Mark Lefebvre , Stephane Menard , James L. Martin , Robert A. Schetty, III , Michael Toben
- 主分类号： C25D502
- IPC分类号： C25D502
摘要：
The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.
公开/授权文献
- US20010047943A1 ELECTROLYTIC COPPER PLATING SOLUTIONS 公开/授权日：2001-12-06
信息查询
