发明授权
- 专利标题： Dicing tape and a method of dicing a semiconductor wafer
- 专利标题（中）： 切割胶带和切割半导体晶片的方法
-
申请号： US09371101申请日： 1999-08-10
-
公开(公告)号： US06444310B1公开(公告)日： 2002-09-03
- 发明人: Hideo Senoo , Takeshi Kondo
- 申请人： Hideo Senoo , Takeshi Kondo
- 优先权： JP10-226009 19980810
- 主分类号： C09J702
- IPC分类号： C09J702
摘要：
A dicing tape comprising a substrate sheet and a pressure-sensitive adhesive layer formed on one surface of the substrate sheet, wherein the substrate sheet comprises an upper layer in direct contact with the pressure-sensitive adhesive layer, an intermediate layer adjacent to the upper layer, and a lower layer adjacent to the intermediate layer, and an anti-extensibility (A) of the upper layer, an anti-extensibility (B) of the intermediate layer, and an anti-extensibility (C) of the lower layer satisfy the equation (I): B
信息查询
