发明授权
US06447914B1 Method of uniformly depositing seed and a conductor and the resultant printed circuit structure 失效
均匀沉积种子和导体以及所得印刷电路结构的方法

Method of uniformly depositing seed and a conductor and the resultant printed circuit structure
摘要:
The present invention comprises a method of making a circuitized structure. The method comprises the steps of providing a substrate coated with a polymeric dielectric layer, treating the substrate with alkali, baking the substrate to modify the surface of the polymeric dielectric layer, applying a seed layer to the polymeric dielectric layer and applying conductive layer to the seed layer. The invention also comprises a printed circuit structure produced by the method of the present invention.
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