发明授权
- 专利标题： Mounting method of semiconductor device
- 专利标题（中）： 半导体器件的安装方法
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申请号： US09045115申请日： 1998-03-20
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公开(公告)号： US06458237B1公开(公告)日： 2002-10-01
- 发明人: Kazuhisa Tsunoi , Hidehiko Kira , Shunji Baba , Akira Fujii , Toshihiro Kusagaya , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
- 申请人： Kazuhisa Tsunoi , Hidehiko Kira , Shunji Baba , Akira Fujii , Toshihiro Kusagaya , Kenji Kobae , Norio Kainuma , Naoki Ishikawa , Satoshi Emoto
- 优先权： JP9-128898 19970519; JP9-289836 19971022
- 主分类号： B32B700
- IPC分类号： B32B700
摘要：
A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.