发明授权
- 专利标题: Antifuse for use with low k dielectric foam insulators
- 专利标题(中): 用于低k电介质泡沫绝缘子的防腐剂
-
申请号: US09417853申请日: 1999-10-14
-
公开(公告)号: US06458630B1公开(公告)日: 2002-10-01
- 发明人: Timothy H. Daubenspeck , William A. Klaasen , William T. Motsiff , Rosemary A. Previti-Kelly , Jed H. Rankin
- 申请人: Timothy H. Daubenspeck , William A. Klaasen , William T. Motsiff , Rosemary A. Previti-Kelly , Jed H. Rankin
- 主分类号: H01L2128
- IPC分类号: H01L2128
摘要:
A fusible link for a semiconductor device comprises an insulating substrate and a conductive line pair on the surface of the insulating substrate, with the conductive line pair having spaced ends. A polymer is disposed over the insulating substrate and between the conductive line pair ends. The polymer is capable of being changed from a non-conductive to a conductive state upon exposure to an energy beam. Preferably, the polymer comprises a polyimide, more preferably, a polymer/onium salt mixture, most preferably, a polyaniline polymer doped with a triphenylsufonium salt. The link may further comprise a low k nanopore/nanofoam dielectric material adjacent the conductive line ends.