发明授权
- 专利标题: Solderable electrical connection element with a solder deposit
- 专利标题(中): 具有焊料沉积的可焊接电气连接元件
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申请号: US09867819申请日: 2001-05-31
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公开(公告)号: US06461188B2公开(公告)日: 2002-10-08
- 发明人: Bernhard Reul
- 申请人: Bernhard Reul
- 优先权: DE10027582 20000602; DE10046489 20000920
- 主分类号: H01R424
- IPC分类号: H01R424
摘要:
According to the invention, a metal insertion piece (6) is provided in a solderable electrical connection element (1) with a thin support sheet (2), at least one metal conductor (3) and at least one free contact face (5), which may be joined to an associated connection face (11) of another component (12), by means of a soldered joint that can be made using a solder deposit (9), which metal insertion piece (6) passes through the connection element (1) and the support sheet (2) respectively in the region of the contact face (5) and is securely joined to this support sheet, which serves as a base for the solder deposit (9). Preferably, the insertion pieces (6) may be derived from conventional crimp attachments. They may also be used for mechanically fastening both the solder deposit (9) and an electrical conductor to the support sheet (2).
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