Invention Grant
- Patent Title: Electroconductive composition and printed circuit board using the same
- Patent Title (中): 导电组合物和使用其的印刷电路板
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Application No.: US09842222Application Date: 2001-04-25
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Publication No.: US06468447B2Publication Date: 2002-10-22
- Inventor: Shuji Matsumoto
- Applicant: Shuji Matsumoto
- Priority: JP2000-124303 20000425
- Main IPC: H01B116
- IPC: H01B116

Abstract:
Provided is an electroconductive paste comprising copper powders, a glass powder, and an organic vehicle, wherein: the copper powders comprise (1) from about 50% to 90% by weight of a copper powder A containing from about 1% to 3% by weight of oxygen and having an average particle size of from about 0.9 to 1.5 &mgr;m; and (2) from about 10% to 50% by weight of a copper powder B containing from about 0.2% to 3% by weight of oxygen and having an average particle size of not more than about 0.6 &mgr;m. It has an excellent electroconductivity as well as a sufficiently large bonding strength to a board.
Public/Granted literature
- US20010042854A1 Electroconductive composition and printed circuit board using the same Public/Granted day:2001-11-22
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