发明授权
- 专利标题: Method of reducing electrical shorts from the bit line to the cell plate
- 专利标题(中): 减少从位线到电池板的电气短路的方法
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申请号: US09399592申请日: 1999-09-20
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公开(公告)号: US06468859B1公开(公告)日: 2002-10-22
- 发明人: Kunal R. Parekh , Charles H. Dennison , Jeffrey W. Honeycutt
- 申请人: Kunal R. Parekh , Charles H. Dennison , Jeffrey W. Honeycutt
- 主分类号: H01L218242
- IPC分类号: H01L218242
摘要:
A stress buffer and dopant barrier in the form of a TetraEthylOrthoSilicate (TEOS) film is deposited after the capacitor cell plate has been etched and cleaned to thereby eliminate electrical shorts from the bit line to the cell plate.
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