发明授权
- 专利标题: Method and apparatus for assembling parts
- 专利标题(中): 组装零件的方法和装置
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申请号: US09756785申请日: 2001-01-10
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公开(公告)号: US06471801B2公开(公告)日: 2002-10-29
- 发明人: Hiroshi Takemoto , Shinobu Kanatani , Yoshihiro Morii , Shigeru Fujita
- 申请人: Hiroshi Takemoto , Shinobu Kanatani , Yoshihiro Morii , Shigeru Fujita
- 优先权: JP10-29351 19980127; JP10-44705 19980209; JP10-44570 19980210; JP10-49044 19980212
- 主分类号: B29C6500
- IPC分类号: B29C6500
摘要:
A method and an apparatus for fixing a part and a part support for mounting the part by use of adhesive via an intermediate member are disclosed. The adhesive is implemented by photocuring adhesive while the intermediate member is formed of a material transparent for light. The intermediate member is free from coloring and deformation when illuminated by light for curing the adhesive. The adhesive is prevented from dropping or turning round to other portions during assembly.
公开/授权文献
- US20010011577A1 Method and apparatus for assembling parts 公开/授权日:2001-08-09
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