An electronic parts cleaning solution comprising a hydroxide, water, metal corrosion inhibitor, and at least one compound represented by the following general formula (I) or (II): HO—((EO)x-(PO)y)z-H  (I) wherein, EO represents an oxyethylene group, PO represents an oxypropylene group, x and y represent integers satisfying the relation: x/(x+y)=0.05 to 0.4, and z represents a positive integer, R—[((EO)x-(PO)y)z-H]m  (II) wherein, EO, PO, x, y and z are the same as in the general formula (I), R represents a residual group obtained by removing a hydrogen atom on a hydroxyl group of alcohol or amine having a hydroxyl group, or a residual group obtained by removing a hydrogen atom on an amino group of amine, and m represents an integer of 1 or more.