发明授权
- 专利标题: Microwave monolithic integrated circuit and fabrication process thereof
- 专利标题(中): 微波单片集成电路及其制造工艺
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申请号: US09776722申请日: 2001-02-06
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公开(公告)号: US06476427B2公开(公告)日: 2002-11-05
- 发明人: Hajime Matsuda
- 申请人: Hajime Matsuda
- 优先权: JP2000-030818 20000208
- 主分类号: H01L2980
- IPC分类号: H01L2980
摘要:
A microwave monolithic integrated circuit comprises a T-shaped gate electrode including a Schottky gate electrode formed on a first region of a compound semiconductor substrate, a pair of ohmic electrodes making an ohmic contact with a surface of the substrate in the first region at respective sides of the T-shaped gate electrode, a lower capacitor electrode pattern formed on a second region of the compound semiconductor substrate with a composition substantially identical with a low-resistance, top electrode constituting the T-shaped gate electrode on the Schottky gate electrode, a dielectric film formed on the lower electrode pattern, and an upper electrode pattern formed on the dielectric film.
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