发明授权
US06476427B2 Microwave monolithic integrated circuit and fabrication process thereof 失效
微波单片集成电路及其制造工艺

  • 专利标题: Microwave monolithic integrated circuit and fabrication process thereof
  • 专利标题(中): 微波单片集成电路及其制造工艺
  • 申请号: US09776722
    申请日: 2001-02-06
  • 公开(公告)号: US06476427B2
    公开(公告)日: 2002-11-05
  • 发明人: Hajime Matsuda
  • 申请人: Hajime Matsuda
  • 优先权: JP2000-030818 20000208
  • 主分类号: H01L2980
  • IPC分类号: H01L2980
Microwave monolithic integrated circuit and fabrication process thereof
摘要:
A microwave monolithic integrated circuit comprises a T-shaped gate electrode including a Schottky gate electrode formed on a first region of a compound semiconductor substrate, a pair of ohmic electrodes making an ohmic contact with a surface of the substrate in the first region at respective sides of the T-shaped gate electrode, a lower capacitor electrode pattern formed on a second region of the compound semiconductor substrate with a composition substantially identical with a low-resistance, top electrode constituting the T-shaped gate electrode on the Schottky gate electrode, a dielectric film formed on the lower electrode pattern, and an upper electrode pattern formed on the dielectric film.
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