发明授权
- 专利标题： Substrate for packaging electronic component and piezoelectric resonance component using the same
- 专利标题（中）： 用于包装电子部件的基板和使用其的压电谐振部件
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申请号： US09728652申请日： 2000-12-01
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公开(公告)号： US06483401B2公开(公告)日： 2002-11-19
- 发明人: Ryuhei Yoshida , Tsuneo Amano
- 申请人： Ryuhei Yoshida , Tsuneo Amano
- 优先权： JP11-343277 19991202
- 主分类号： H03H915
- IPC分类号： H03H915
摘要：
A substrate of a case for packaging an electronic component includes a conductive cap bonded to a substrate to cover the electronic component and to tightly seal an enclosed space. The substrate has a substrate body layer, electrodes disposed on the substrate body layer, and a glass ceramic layer disposed on the substrate body layer so as to cover a portion of the electrodes.
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