发明授权
- 专利标题： Molded tape ball grid array package
- 专利标题（中）： 成型带球网格阵列包装
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申请号： US09703199申请日： 2000-10-31
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公开(公告)号： US06489571B1公开(公告)日： 2002-12-03
- 发明人: Chok J. Chia , Qwai H. Low , Patrick Variot
- 申请人： Chok J. Chia , Qwai H. Low , Patrick Variot
- 主分类号： H05K109
- IPC分类号： H05K109
摘要：
A molded tape ball grid array package includes a molding compound and a tape substrate having a top surface for mounting a die thereon, a bottom surface for attaching solder balls, and vias for forming connections between the solder balls and the die wherein the molding compound surrounds the die and the tape substrate.
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