Invention Grant
- Patent Title: Processes for treating electronic components
- Patent Title (中): 处理电子部件的方法
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Application No.: US09805348Application Date: 2001-03-13
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Publication No.: US06491763B2Publication Date: 2002-12-10
- Inventor: Steven Verhaverbeke , Lewis Liu , Alan Walter , C. Wade Sheen , Christopher McConnell
- Applicant: Steven Verhaverbeke , Lewis Liu , Alan Walter , C. Wade Sheen , Christopher McConnell
- Main IPC: B08B300
- IPC: B08B300
Abstract:
A process for treating an electronic component wherein the electronic component is exposed to a heated solvent and subsequently exposed to an ozonated process fluid. The electronic component is optionally exposed to the heated solvent by exposing the electronic component to a passing layer of heated solvent. An apparatus for treating electronic components with a heated solvent and an ozonated process fluid is also provided.
Public/Granted literature
- US20020033186A1 Processes and apparatus for treating electronic components Public/Granted day:2002-03-21
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