发明授权
- 专利标题： Chip scale packaging with multi-layer flip chip arrangement and ball grid array interconnection
- 专利标题（中）： 芯片级封装采用多层倒装芯片布置和球栅阵列互连
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申请号： US09667837申请日： 2000-09-22
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公开(公告)号： US06492726B1公开(公告)日： 2002-12-10
- 发明人: Shyue Fong Quek , Ying Keung Leung , Sang Yee Loong , Ting Cheong Ang
- 申请人： Shyue Fong Quek , Ying Keung Leung , Sang Yee Loong , Ting Cheong Ang
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
In accordance with the objectives of the invention a new package is provided that is provided with a cavity that is shaped such that more than one semiconductor device can in a vertical direction be mounted in the cavity of the package. The devices that are mounted inside the cavity of the package are separated by separate components of insulation, the overlying devices are electrically interconnected by horizontally positioned solder bumps and vertical interconnect plugs.
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