发明授权
US06495007B2 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces 失效
用于在工作场所的电抛光和/或电镀期间保持和定位半导体工件的方法和装置

  • 专利标题: Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces
  • 专利标题(中): 用于在工作场所的电抛光和/或电镀期间保持和定位半导体工件的方法和装置
  • 申请号: US09800990
    申请日: 2001-03-07
  • 公开(公告)号: US06495007B2
    公开(公告)日: 2002-12-17
  • 发明人: Hui Wang
  • 申请人: Hui Wang
  • 主分类号: B23H304
  • IPC分类号: B23H304
Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces
摘要:
A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.
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