Disclosed is a hologram transfer film which can realize easy and good transfer of a hologram and, at the same time, can realize stable transfer of the hologram in a transfer process. The hologram transfer film comprises: a substrate film; and a transfer layer provided on the substrate film, the transfer layer comprising a hologram-forming layer and a heat-sensitive adhesive layer provided in that order on the substrate film, the hologram-forming layer having a breaking strain of 0.5 to 15% at 25° C. and a breaking strain of 0.5 to 30% at 120° C.