发明授权
- 专利标题： Transfer mark structure for multi-layer interconnecting and method for the manufacture thereof
- 专利标题（中）： 用于多层互连的转印标记结构及其制造方法
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申请号： US09467910申请日： 1999-12-21
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公开(公告)号： US06495928B1公开(公告)日： 2002-12-17
- 发明人: Yasushi Hashizume , Takahisa Eimori
- 申请人： Yasushi Hashizume , Takahisa Eimori
- 优先权： JP11-191875 19990706
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
A transfer mark structure for a multi-layer interconnecting process for avoiding the influence of dishing when a groove pattern for multi-layer interconnection is formed, and for improving the accuracy and stability of reading the transfer mark used for transfer in the following step so as to align with a location of transfer in the preceding step, and a method for producing such a transfer mark for the multi-layer interconnecting process. The underlying layer 102 immediately under the transfer mark 22 for photoengraving formed in the step of connecting between interconnecting layers 16 has a groove-like pattern.
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