Invention Grant
- Patent Title: Method of making a circuit board
- Patent Title (中): 制作电路板的方法
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Application No.: US09812449Application Date: 2001-03-20
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Publication No.: US06499214B2Publication Date: 2002-12-31
- Inventor: Delin Li , Richard Keith McMillan , Zhong-You Shi
- Applicant: Delin Li , Richard Keith McMillan , Zhong-You Shi
- Main IPC: H05K320
- IPC: H05K320
Abstract:
A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.
Public/Granted literature
- US20020136873A1 METHOD OF MAKING A CIRCUIT BOARD Public/Granted day:2002-09-26
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