发明授权
US06500489B1 Low temperature CVD processes for preparing ferroelectric films using Bi alcoxides
有权
使用Bi alcoxides制备铁电薄膜的低温CVD工艺
- 专利标题: Low temperature CVD processes for preparing ferroelectric films using Bi alcoxides
- 专利标题(中): 使用Bi alcoxides制备铁电薄膜的低温CVD工艺
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申请号: US09208541申请日: 1998-12-09
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公开(公告)号: US06500489B1公开(公告)日: 2002-12-31
- 发明人: Frank S. Hintermaier , Peter C. Van Buskirk , Jeffrey F. Roeder , Bryan C. Hendrix , Thomas H. Baum , Debra A. Desrochers
- 申请人: Frank S. Hintermaier , Peter C. Van Buskirk , Jeffrey F. Roeder , Bryan C. Hendrix , Thomas H. Baum , Debra A. Desrochers
- 主分类号: C23C1640
- IPC分类号: C23C1640
摘要:
Chemical vapor deposition is used to form a film of Bi oxide, Sr oxide, and Ta oxide on a heated substrate by decomposing the precursors of these oxides at the surface of the substrate. The precursor of Bi oxide is a Bi complex which includes at least one alkoxide group and is decomposed and deposited at a temperature lower than 450° C. The film of Bi, Sr, and Ta oxides obtained by low-temperature CVD is predominantly non-ferroelectric, but can be converted into a ferroelectric film by a subsequent heating process.
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