Invention Grant
- Patent Title: Low signal loss bonding ply for multilayer circuit boards
- Patent Title (中): 多层电路板的低信号损耗键合层
-
Application No.: US09952486Application Date: 2001-09-14
-
Publication No.: US06500529B1Publication Date: 2002-12-31
- Inventor: Thomas F. McCarthy , David L. Wynants, Sr.
- Applicant: Thomas F. McCarthy , David L. Wynants, Sr.
- Main IPC: B32B300
- IPC: B32B300
Abstract:
A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
Information query
