发明授权
- 专利标题: Channel implant through gate polysilicon
- 专利标题(中): 沟道通过栅极多晶硅植入
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申请号: US09741776申请日: 2000-12-19
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公开(公告)号: US06503805B2公开(公告)日: 2003-01-07
- 发明人: Zhongze Wang , Rongsheng Yang
- 申请人: Zhongze Wang , Rongsheng Yang
- 主分类号: H01L21336
- IPC分类号: H01L21336
摘要:
A field effect transistor having a doped region in the substrate immediately underneath the gate of the transistor and interposed between the source and drain of the transistor is provided. The doped region has a retrograde dopant profile such that the doping concentration immediately adjacent the gate is selected to allow for the formation of a channel when a threshold voltage is applied to the gate thereby eliminating the need for an enhancement doping step during formation of the transistor. The retrograde doping profile increases with the depth into the substrate which inhibits stray currents from traveling between the source and drain of the transistor in the absence of the formation of a channel as a result of voltage being applied to the gate of the transistor.
公开/授权文献
- US20010016389A1 Channel implant through gate polysilicon 公开/授权日:2001-08-23
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