A ball grid array (BGA) socket (5) includes an insulative member (52), a number of conductive contacts (54) attached to the insulative member in an array and a number of solder balls (56) respectively attached to corresponding conductive contacts and arranged in an array in accordance with the conductive contacts. The insulative member provides a number of stand-offs (60) on the mounting surface thereof and located in the array of the solder balls. When the BGA socket is located on a printed circuit board (PCB, 80) and heated, the solder balls become soft or melted and the insulative member sinks until the stand-offs bear against the PCB. Since the stand-offs are located in the array of the solder balls, the solder balls are not spaced from the PCB too close or too far, therefore the solder balls close a center of the connector may not be disconnected from corresponding solder pads or interconnect with the adjacent solder balls.