- 专利标题: Electronic apparatus having a heat dissipation member
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申请号: US09791777申请日: 2001-02-26
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公开(公告)号: US06507493B2公开(公告)日: 2003-01-14
- 发明人: Akira Ueda , Masumi Suzuki , Minoru Hirano , Toyokazu Hamaguchi , Shigeru Hidesawa
- 申请人: Akira Ueda , Masumi Suzuki , Minoru Hirano , Toyokazu Hamaguchi , Shigeru Hidesawa
- 优先权: JP8-270245 19961011
- 主分类号: H05K720
- IPC分类号: H05K720
摘要:
The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
公开/授权文献
- US20010050840A1 Electronic apparatus having a heat dissipation member 公开/授权日:2001-12-13
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