Invention Grant
- Patent Title: Laser cutting machine and method
- Patent Title (中): 激光切割机及方法
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Application No.: US09657795Application Date: 2000-09-08
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Publication No.: US06509545B1Publication Date: 2003-01-21
- Inventor: Hans Klingel
- Applicant: Hans Klingel
- Priority: DE19943043 19990909
- Main IPC: B23K2614
- IPC: B23K2614
Abstract:
A machine and a process for thermal cutting of workpieces has at least one workpiece support (8) for the workpiece, at least one thermal cutting device (2), and at least one machine device (10, 11) to move the workpiece support (8) and the cut product adhering to the workpiece support (8) after the workpiece is cut relative to at least one stop (10) to loosen cut product adhering to the workpiece support (8).
Information query
