发明授权
- 专利标题: Method for forming a dielectric laminated device
- 专利标题(中): 电介质层叠装置的形成方法
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申请号: US09892259申请日: 2001-06-27
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公开(公告)号: US06510607B1公开(公告)日: 2003-01-28
- 发明人: Hideaki Nakakubo , Toshio Ishizaki , Toru Yamada , Hiroshi Kagata , Tatsuya Inoue , Shoichi Kitazawa
- 申请人: Hideaki Nakakubo , Toshio Ishizaki , Toru Yamada , Hiroshi Kagata , Tatsuya Inoue , Shoichi Kitazawa
- 优先权: JP8-184593 19960715
- 主分类号: H01K300
- IPC分类号: H01K300
摘要:
By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.
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