发明授权
- 专利标题: Substrate processing method and substrate processing apparatus
- 专利标题(中): 基板处理方法和基板处理装置
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申请号: US09702679申请日: 2000-11-01
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公开(公告)号: US06513537B1公开(公告)日: 2003-02-04
- 发明人: Takehiko Orii , Hiroki Ohno , Takashi Yabuta
- 申请人: Takehiko Orii , Hiroki Ohno , Takashi Yabuta
- 优先权: JP11-310735 19991101
- 主分类号: B08B600
- IPC分类号: B08B600
摘要:
The present invention relates to a method of removing a polymer veil and a metal contamination deposited on a substrate having a metal layer. First, the polymer veils are removed by a chemical liquid in an inert gas atmosphere. Subsequently, the metal contamination are removed by oxidizing the metal contamination into metal oxide contamination by mixing oxygen in a small concentration in the inert gas atmosphere, and dissolving the metal oxide contamination by the chemical liquid.
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