One aspect of the present invention relates to a method and an apparatus for rinsing a substrate during a development process to mitigate pattern collapse. The apparatus includes a bath chamber; a substrate holder disposed in the bath chamber for holding the substrate having a resist pattern formed thereon; a first nozzle for dispensing a first rinsing solution having a first density and first surface tension into the bath chamber; a second nozzle for dispensing a second rinsing solution having a second density and second surface tension, which is less than the first rinsing solution, into the bath chamber; a drain disposed in a bottom portion of the bath chamber; and a controlling system operatively coupled to the first nozzle, the second nozzle and the drain designed to regulate and coordinate the operation of the first nozzle, the second nozzle and the drain.