An exposure apparatus is arranged to project one unit of a circuit pattern onto the surface of a resist on a substrate to be manufactured and to expose it over the surface of this resist. The exposure apparatus includes a processing unit that enables forming a high-resolution circuit pattern image on the substrate by the use of an image display which is able to ensure a wide display region without deteriorating the resolution, and that when dividing the one unit of circuit pattern into a plurality of regions in order to ensure an inexpensive, reliable exposure operation, divides it so that adjacent ones of the divided regions may partly overlap each other. An exposure device includes a plurality of optical systems each of that projects one of a plurality of the divided regions onto the surface of the resist on the substrate. A control unit causes a plurality of the divided regions to be simultaneously projected on the surface of the resist in such a way as to cause duplex regions between the adjacent regions to overlap each other on the surface of the resist on the substrate to thereby cause the one unit of circuit pattern image to be formed on the surface of the resist on the substrate.