发明授权
- 专利标题: Solder ball and method for producing same
- 专利标题(中): 焊球及其制造方法
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申请号: US09805366申请日: 2001-03-14
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公开(公告)号: US06517602B2公开(公告)日: 2003-02-11
- 发明人: Koji Sato , Takeshi Kuboi , Masayoshi Date
- 申请人: Koji Sato , Takeshi Kuboi , Masayoshi Date
- 优先权: JP2000-070534 20000314; JP2000-200599 20000703; JP2000-241610 20000809
- 主分类号: B22F908
- IPC分类号: B22F908
摘要:
A solder ball having a diameter of 1.2 mm or less, a dispersion of a diameter distribution of 5% or less and sphericity of 0.95 or more, an area ratio of the maximum dendrite being 80% or less of a cross section including a center of the solder ball, comprises a first additional element of 0.5-8 mass % of Ag and/or 0.1-3 mass % of Cu, and 0.006-10 mass %, in total, of at least one second additional element selected from the group consisting of Bi, Ge, Ni, P, Mn, Au, Pd, Pt, S, In and Sb, the balance being substantially Sn. The solder ball is produced by a uniform droplet-spraying method comprising the steps of vibrating a melt of a solder alloy in a crucible under pressure to force the melt to drop through orifices of the crucible; permitting the melt dropping through the orifices to become spherical droplets in a non-oxidizing gas atmosphere; and rapidly solidifying them.
公开/授权文献
- US20020051728A1 Solder ball and method for producing same 公开/授权日:2002-05-02