发明授权
- 专利标题: Plating device
- 专利标题(中): 电镀装置
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申请号: US09463019申请日: 2000-01-19
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公开(公告)号: US06517689B1公开(公告)日: 2003-02-11
- 发明人: Akihisa Hongo , Kenichi Suzuki , Atsushi Chono , Mitsuo Tada , Akira Ogata , Satoshi Sendai , Koji Mishima
- 申请人: Akihisa Hongo , Kenichi Suzuki , Atsushi Chono , Mitsuo Tada , Akira Ogata , Satoshi Sendai , Koji Mishima
- 优先权: JP10-195932 19980710; JP10-202270 19980716
- 主分类号: B23H302
- IPC分类号: B23H302
摘要:
The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with conductive layers of a substrate. The present invention also provides an electroplating apparatus, which is able to produce uniform currents to flow through each of feeding contacts. The apparatus has a plating vessel, in which an electrode is disposed opposite to a substrate which is affixed to a plating jig electrically through a plurality of feeding contacts for applying a specific voltage between the electrode and conductive layers provided on a plating surface of the substrate. Plating current flows from the plating jig through the feeding contacts to the substrate. A conduction detection device is provided to detect electrical conductive states between the plurality of feeding contacts and the conductive layer on the substrate.