A carrier for receiving and holding a plurality of semiconductor wafers and permitting surfaces of the wafers to receive maximum exposure to ultrasonic waves during a wafer cleaning process in which the carrier and the wafers are immersed in a liquid medium and ultrasonic waves are generated in the liquid medium. The carrier includes two vertical sidewalls and at least three horizontal supporting rods that interconnect the sidewalls and that are collectively positioned for supporting wafers in generally upright, face to face position generally parallel to each other. At least one stabilizing rod extends horizontally between the sidewalls for limiting wafer motion relative to the carrier to steady the wafers. A series of spaced apart teeth on the stabilizing rod define troughs for receiving wafers loosely therein to prevent substantial vibratory deflections of the wafers.