发明授权
- 专利标题： Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board
- 专利标题（中）： 生片及其制造方法，多层布线板的制造方法以及双面布线板的制造方法
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申请号： US09492781申请日： 2000-01-27
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公开(公告)号： US06521069B1公开(公告)日： 2003-02-18
- 发明人: Yasuhiro Sugaya , Osamu Inoue , Junichi Kato
- 申请人： Yasuhiro Sugaya , Osamu Inoue , Junichi Kato
- 优先权： JP11-018333 19990127; JP2000-009073 20000118
- 主分类号： B32B3126
- IPC分类号： B32B3126
摘要：
A green sheet including a binder containing an acrylic resin having no polar group and a ceramics material in powder is prepared, and connection via are formed in the green sheet. Further, a conductor layer having virtually no voids is placed on the green sheet and a mask is also placed on the conductor layer. Then, the conductor layer is patterned by wet-etching so that wiring is formed thereon. A plurality of the green sheets thus formed are laminated, and a binding sheet, which contains an inorganic composition that has virtually no sintering shrinkage at the firing temperature of the multi-layered body as a main component, is formed on either both surfaces or one surface of the laminated body, and this is then fired, and thereafter, the binding sheet is removed.