Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy

Invention Grant

US06521176B2 Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy 失效

Title translation: 无铅焊料合金和使用这种无铅焊料合金的电气和电子设备的制造过程

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Patent Title: Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy
Patent Title (中): 无铅焊料合金和使用这种无铅焊料合金的电气和电子设备的制造过程
Application No.: US09728120

Application Date: 2000-12-04
Publication No.: US06521176B2

Publication Date: 2003-02-18
Inventor: Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
Applicant: Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
Priority: JP6-235734 19940929; JP7-059561 19950317
Main IPC: C22C1302
IPC: C22C1302

Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy

Abstract:

A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract(Chinese):

含有Sn，Ag和Bi的无铅焊料合金组合物，各自的浓度设定为使得无铅焊料合金的熔融温度低于要焊接的工件的预定耐热温度。

Public/Granted literature

US20010001990A1 Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy Public/Granted day:2001-05-31

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