- 专利标题: Wafer edge cleaning method and apparatus
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申请号: US09281618申请日: 1999-03-30
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公开(公告)号: US06523553B1公开(公告)日: 2003-02-25
- 发明人: Fred C. Redeker , Brian J. Brown , Michael Sugarman
- 申请人: Fred C. Redeker , Brian J. Brown , Michael Sugarman
- 主分类号: B08B304
- IPC分类号: B08B304
摘要:
A method and apparatus is provided for removing material from the edge of a disk. In one embodiment, the edge of the disk is contacted with etchant via an etchant containing swab or trough (which may contain one or more transducers) and is rotated such that successive portions of the disk edge are scanned through the trough or past the swab. To prevent etchant from contacting the major surface of the substrate, and/or to prevent excessive etching, the edge of the disk is contacted with a rinsing fluid (e.g., a rinsing fluid nozzle or a trough filled with rinsing fluid). In a further embodiment material such as residue or particles may be removed via a trough containing sonically energized rinsing fluid.
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