发明授权
US06524914B1 Source side boron implanting and diffusing device architecture for deep sub 0.18 micron flash memory
有权
源极硼注入和扩散器件架构,用于深亚0.18微米闪存
- 专利标题: Source side boron implanting and diffusing device architecture for deep sub 0.18 micron flash memory
- 专利标题(中): 源极硼注入和扩散器件架构,用于深亚0.18微米闪存
-
申请号: US09699972申请日: 2000-10-30
-
公开(公告)号: US06524914B1公开(公告)日: 2003-02-25
- 发明人: Yue-song He , Sameer Haddad , Timothy Thurgate , Chi Chang
- 申请人: Yue-song He , Sameer Haddad , Timothy Thurgate , Chi Chang
- 主分类号: H01L218247
- IPC分类号: H01L218247
摘要:
One aspect of the present invention relates to a method of making a flash memory cell involving the steps of providing a substrate having a flash memory cell thereon; forming a self-aligned source mask over the substrate, the self aligned source mask having openings corresponding to source lines; implanting a source dopant of a first type in the substrate through the openings in the self-aligned source mask corresponding to source lines; removing the self-aligned source mask from the substrate; cleaning the substrate; and implanting a medium dosage drain implant of a second type to form a source region and a drain region in the substrate adjacent the flash memory cell.
信息查询