发明授权
US06524914B1 Source side boron implanting and diffusing device architecture for deep sub 0.18 micron flash memory 有权
源极硼注入和扩散器件架构,用于深亚0.18微米闪存

Source side boron implanting and diffusing device architecture for deep sub 0.18 micron flash memory
摘要:
One aspect of the present invention relates to a method of making a flash memory cell involving the steps of providing a substrate having a flash memory cell thereon; forming a self-aligned source mask over the substrate, the self aligned source mask having openings corresponding to source lines; implanting a source dopant of a first type in the substrate through the openings in the self-aligned source mask corresponding to source lines; removing the self-aligned source mask from the substrate; cleaning the substrate; and implanting a medium dosage drain implant of a second type to form a source region and a drain region in the substrate adjacent the flash memory cell.
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