发明授权
US06525544B1 Method for predicting lifetime of insulating film and method for reliability testing of semiconductor device 失效
绝缘膜寿命预测方法及半导体器件可靠性测试方法

  • 专利标题: Method for predicting lifetime of insulating film and method for reliability testing of semiconductor device
  • 专利标题(中): 绝缘膜寿命预测方法及半导体器件可靠性测试方法
  • 申请号: US09762951
    申请日: 2001-02-15
  • 公开(公告)号: US06525544B1
    公开(公告)日: 2003-02-25
  • 发明人: Kenji Okada
  • 申请人: Kenji Okada
  • 优先权: JP11-167824 19990615
  • 主分类号: H01H3112
  • IPC分类号: H01H3112
Method for predicting lifetime of insulating film and method for reliability testing of semiconductor device
摘要:
A total injected electron quantity QBD, which has reached a constant value against a variation in stress voltage applied to an insulating film for use in a semiconductor device, is obtained as a critical injected electron quantity QBDcrit. The total injected electron quantity QBD is a total quantity of electrons injected into the insulating film before the film causes a dielectric breakdown. Thereafter, a time it should take for a total quantity of electrons, injected into the insulating film under actual operating conditions of the device, to reach the critical injected electron quantity QBDcrit is estimated as the expected lifetime of the insulating film.
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