发明授权
- 专利标题: Probe structures for testing electrical interconnections to integrated circuit electronic devices
- 专利标题(中): 用于测试集成电路电子设备的电互连的探头结构
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申请号: US09081342申请日: 1998-05-19
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公开(公告)号: US06525551B1公开(公告)日: 2003-02-25
- 发明人: Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Eugene John O'Sullivan , Da-Yuan Shih
- 申请人: Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Eugene John O'Sullivan , Da-Yuan Shih
- 主分类号: G01R3102
- IPC分类号: G01R3102
摘要:
A probe structure for probing an electronic device. The probe has: a substrate having a substrate surface having a plurality of substrate electrical contact locations;a plurality of elongated electrical conductors having a first and second end; the first end of each of the plurality of elongated electrical conductors is electrically connected to one of the plurality of substrate electrical contact locations; a plate having a first and second side, and having a plurality of openings therein extending from the first side to the second side; the plate is disposed so that the first side thereof faces sad substrate; the second end of each of the plurality of elongated electrical conductors extends through one of the openings in the plate; a support for maintaining the plate at a distance from the substrate surface; the distance is selected so that the second ends project out from the second side of the plate a sufficient amount so that when the probe structure is pressed against a device under test the second ends of the elongated electrical conductors are maintained within a displacement from an original position by the opening so that the second ends of the elongated electrical conductors remain in contact with an electrical contact location on the device under test.
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