发明授权
US06525551B1 Probe structures for testing electrical interconnections to integrated circuit electronic devices 失效
用于测试集成电路电子设备的电互连的探头结构

Probe structures for testing electrical interconnections to integrated circuit electronic devices
摘要:
A probe structure for probing an electronic device. The probe has: a substrate having a substrate surface having a plurality of substrate electrical contact locations;a plurality of elongated electrical conductors having a first and second end; the first end of each of the plurality of elongated electrical conductors is electrically connected to one of the plurality of substrate electrical contact locations; a plate having a first and second side, and having a plurality of openings therein extending from the first side to the second side; the plate is disposed so that the first side thereof faces sad substrate; the second end of each of the plurality of elongated electrical conductors extends through one of the openings in the plate; a support for maintaining the plate at a distance from the substrate surface; the distance is selected so that the second ends project out from the second side of the plate a sufficient amount so that when the probe structure is pressed against a device under test the second ends of the elongated electrical conductors are maintained within a displacement from an original position by the opening so that the second ends of the elongated electrical conductors remain in contact with an electrical contact location on the device under test.
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